IBM today announced an innovative new semiconductor wafer reclamation process pioneered at its Burlington, Vermont manufacturing facility. The new process uses a specialized pattern removal technique to repurpose scrap semiconductor wafers — thin discs of silicon material used to imprint patterns that make finished semiconductor chips for computers, mobile phones, video games, and other consumer electronics — to a form used to manufacture silicon-based solar panels. The new process was recently awarded the “2007 Most Valuable Pollution Prevention Award” from The National Pollution Prevention Roundtable (NPPR). http://www-03.ibm.com/press/us/en/pressrelease/22504.wss
Post time: Feb-17-2017