Application
The scribing processing(cutting,scribing) of solar PV industry,like monocrystalline silicon, poly crystilline silicon solar cells and silicon wafers.
Technology characters
1.The edge of scribing line is smooth, could avoid small cracks by knife cutting and upgrade production quality.
2.High working efficiency, the scribing speed is 1.5-2 times faster than lamp pumped laser.
3.Because laser is utilized instantaneous high temprature to work on material surface, its hot influencing area is small and there is no impurity to remain, with high optical transmitting efficiency.
4.Non-contact process method, , it has no pollution for environment
5.To scribe or cutting the cell or wafer of Monocrystalline Silicon, Silicon Polycrystal Silicon, amorphous siliconin solar industry; To scribe the thin film amprphous silicon battery; Substrate The rowing slice and cutting of semi conductor substrate materials such as electron trade silicon, germanium, the GaAs etc…
Highlights :
1. Basic mode (TEM00) output;
2. Input power is only 1/10 of YAG scriber;
3. Compact size ;
4. Free maintenance for more than 100,000hours;
Main Technical Parameters
Model GSC-10F GSC-20F
Laser wave length 1064nm
Laser power 10w / 20W ( CW or Pulse )
Scribing width 30µm
Scribing speed 120mm/s ~260mm/s
Scrining accuracy + 10µm
Working area 350X350mm
Working power 220V/50Hz/1kVA
Working table negative pressure adsobing and dust elimination
Cooling method forced air cooling
Maintenance free time 100,000 hours
Post time: Feb-18-2017