High-power operation of assemblies and closely packed components require effective heat transfer to a heat sink in thermal contact with the circuit board (in the video represented as a glass body for better visibility). Inefficient heat transfer causes assemblies to overheat, which may damage the electrical components or result in failures in operation. The heat dissipated by the components is transferred from the assembly to the heat sink’s cooling surface, which is usually made of metal (aluminium), by so-called thermally conductive adhesives. These materials fill the voids present in the interface between the two objects caused by surface roughness or similar effects. However, their very high viscosity often poses greater challenges in the joining of two objects. The fast and patented method of vacuum bonding presents a joining process-reliable result in interaction with our volumetric piston dispensers. During evacuation the air between heat sink and board is removed completely. When air is introduced afterwards, the instantly rising air pressure bonds the heat sink tightly and evenly to the surface of the circuit board. The distance between the two surfaces is determined by grains that are added homogeneously to the adhesive.
Advantages:
- Uniform and seamless distribution of the adhesive without air inclusions
- No risk of damage by handling the component without stress
- Even pressure force on the component
- Optimal heat dissipation
Additional information: http://bit.ly/1q0CQaA
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Post time: Jan-15-2017