■ Patent Coulomb-Force E-Chuck (Electrostatic Chuck) :
Patent Coulomb-Force E-Chuck has been developed long time and has dozens of international patents.
Except outstanding adhesion abilities and features, advanced technology make E-Chuck as move-free carrier to support hardness or shape reinforcements.
Patent Coulomb-Force E-Chuck has best characteristics than many electrostatic chucks under long-term advanced researches and developments.
■ Features:
(1) Coulomb-Force Electrostatic Chuck.
(2) Patent Coulomb-Force E-Chuck was developed long time and has dozens of international patents.
(3) Stable and uniform adhesion force is achieved by applying the voltage to the electrode
(4) Apply lowest voltage to keep maximum adhesion force.
(5) Because voltage potential of object backside is zero, adhesion will not affect the backside circuits.
(6) Be able to adhere various materials : metal / semiconductor / glass / paper / porous materials.
(7) Work normally in a vacuum environments and general atmospheric environments.
(8) Cab define adhesion area and non-adhesion area. Non-adhesion area can define other functions.
(9) Can be made by different substrates. Such as stainless, aluminum, ceramic, semiconductor wafer or glass.
(10) Can be customized into various sizes and thicknesses for customer’s applications.
(11) Developed by special technology to enclose electrical field in the E-Chuck. After adhesion setting, Move-Free Cordless Supporter can move freely even disconnecting the power supply.
■ Main Handling Applications
(1) Big Size Flat Panel
(2) Semiconductor Thin Wafer
(3) Move-Free Shape Reinforcement Carrier (Eg, 4″ Wafer-on-6″ E-Chuck)
(4) Flexible Copper Foil
(5) Curved Glass
(6) Borderless Screens
(7) Vacuum Lamination
■ Main Products
① (Wired) Stage Holder:
1. Real time power switch to set adhesion or release.
2. Maximum operating temperature: 200 degrees centigrade (E-Chuck surface).
3. Suitable for automation equipments. (Eg, curved glass, borderless screen, vacuum press.)
② (Cordless) Move-Free Supporter:
1. Be able to keep adhesion without power source connection.
2. Need connect controller for about 30 seconds to switch the adhesion state.
3. After adhesion setting, move-free supporter can keep adhesion status even disconnecting power.
4. Maximum operating temperature: 250 degrees centigrade.
5. Suitable to adhere soft and thin objects. (Eg, thin wafer, 4″wafer-on-6″chuck Shape Reinforcement Carrier).
③ (Battery Power) Palm:
1. Use battery as power source.
2. Suitable to adhere small and lightweight objects. (Eg, 12 “wafers, 7″ flat glass.)
④ Other Custom E-Chuck:
1. Patent Cordless Holder (built-in battery, suitable for conveying lightweight objects)
2. Patent Electric Belt (curved cylinder shape E-Chuck) (Eg, Paper Printer.)
3. Anti-wrinkle E-Chuck (Eg, soft copper foil.)
■ Demo Video :
⓪Patent Advanced E-Chuck Ability Demo
①(Wired) Stage Holder : Glass & Paper Adhesion
②(Cordless) Move-Free Supporter : Warpage Support Handling
③(Battery Power) Palm : Semiconductor Wafer Adhesion
④Custom : Copper Foil Adhesion
Contact info :
E-mail : [email protected]
EDRAGON TECHNOLOGY CORPORATION
Post time: Jan-18-2017