The Ohashi MS-04 Device Mounter is used to place devices on to a substrate where ACF (anisotropic conductive film) has been laminated. Devices may be flexible printed circuits, displays, ICs, or any other device used in ACF assembly. This machine is often used with the Ohashi LS-02 ACF Laminator and Ohashi BS-03/04 Bonder to form a semi-automatic production line capable of 1200UPH.
Post time: Jan-23-2017