DuPont™ Pyralux®TK laminate, designed for high speed digital and high frequency flexible circuit applications, enables you to take your circuit design to new heights with increased speed and flexibility.
DuPont™ Pyralux® TK flexible circuit material is a copper clad laminate and bonding film system specifically formulated with DuPont™ Teflon® fluoropolymer film and Kapton® polyimide film for high speed digital and high frequency flexible circuit applications. DuPont™ Pyralux® TK delivers the lowest dielectric constant (DK) of any thin laminate and bondply material on the market today. Learn more at:
http://dptn.ws/6054ju2A
Post time: Jan-19-2017